Round 932KDB산업은행 NextRound
[R 932] Tokyo / 11.18. (수) 2PM
사전 신청 없이 자유롭게 현장참석 가능합니다
[IR Session 1 : Deep Tech]
1. ePort : Core filler materials for semiconductor packaging
2. Ettifos : V2X and defense wireless communication chip design
3. NanoForge AI : AI/robotics-based new materials platform
4. Readi Robust Machine : Energy-efficiency systems for industrial heavy machinery
[R 932] Tokyo / 11.18. (수) 2PM